We offer support in conjunction with our manufacturing partners to develop sensor chip geometries and multi elements semiconductor sensor solutions The resulting standard and/or custom chip can be packaged in a number of standard packages or Chip on board - mixed technology, FR4, aluminum or ceramic substrates. Contact us for more details.
- Range of Chip Technologies
- Standard and custom geometries, linear and matrix arrays
- Packaging Solutions
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silonex epigap kaypul Optoklic detectors emitters assemblies custom chips and devices custom assemblies optical filters contact site map home |
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TelephoneTel +44 (0)1229 581551 Euan Davidson - Technical Sales Carol Davidson - Administration Linda Hair - Sales and Marketing |
Please feel free to submit your details to arrange further contact.